LR6 battery.Manufacturing process flow of crystalline silicon solar cells

　　Manufacturing process flow of crystalline silicon solar cells

　　1. The specific manufacturing process technology description is as follows:

　　(1) Slicing: Use multi-line cutting to cut the silicon rod into square silicon wafers.

　　(2) Cleaning: Use conventional silicon wafer cleaning methods, and then use acid (or alkali) solution to remove 30-50um of the damaged layer on the surface of the silicon wafer.

　　(3) Preparation of textured surface: Use an alkali solution to anisotropically etch the silicon wafer to prepare a textured surface on the surface of the silicon wafer.

　　(4) Phosphorus diffusion: Use a coating source (or liquid source, or solid phosphorus nitride flake source) for diffusion to form a pN+ junction. The junction depth is generally 0.3-0.5um.

　　(5) Peripheral etching: The diffusion layer formed on the peripheral surface of the silicon wafer during diffusion will short-circuit the upper and lower electrodes of the battery. Use masked wet etching or plasma dry etching to remove the peripheral diffusion layer.

　　(6) Remove the backside pN+ junction. Wet etching or grinding methods are commonly used to remove the pN+ junction on the back side.

　　(7) Make upper and lower electrodes: use vacuum evaporation, electroless nickel plating or aluminum paste printing and sintering. Make the lower electrode first, then the upper electrode. Aluminum paste printing is a widely used process method.

　　(8) Make an anti-reflective film: In order to reduce the loss of incident reflection, a layer of anti-reflective film must be covered on the surface of the silicon wafer. Materials used to make anti-reflective coatings include MgF2, SiO2, Al2O3, SiO, Si3N4, TIO2, Ta2O5, etc. The process method can be vacuum coating method, ion plating method, sputtering method, printing method, pECVD method or spraying method, etc.

　　(9) Sintering: The battery chip is sintered on a nickel or copper base plate.

　　(10) Test classification: test classification according to specified parameter specifications. It can be seen that the manufacturing process of solar cell chips is basically the same as that of semiconductor devices, and the production process equipment is also basically the same. However, the processing accuracy is far lower than the manufacturing requirements of integrated circuit chips, which provides opportunities for the large-scale production of solar cells. favorable conditions.

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